Lilian Nyiva
The Higher Education Loans Board (HELB) has issued a key update to students awaiting the opening of the first-time student loan application portal for the 2026/2027 academic year.
According to HELB Chief Executive Officer Geoffrey Monari, the online application portal for new university and Technical and Vocational Education and Training (TVET) students is expected to open in the second week of July, subject to the completion of the placement process by the Kenya Universities and Colleges Central Placement Service (KUCCPS).
Monari said HELB is finalising preparations and is waiting for KUCCPS to release placement results before activating the portal for first-time applicants.
Portal Depends on KUCCPS Placement
HELB explained that loan applications for newly admitted students can only begin after KUCCPS completes the allocation of students to universities and TVET institutions.
The board assured students and parents that an official communication will be issued once the placement exercise is concluded and the application portal is ready to receive submissions.
Continuing Students Already Applying
While first-time applicants are still waiting, HELB has already opened the 2026/2027 subsequent loan application window for continuing students. The application process began on June 1, with eligible students able to apply through the HELB USSD service (*642#) and other official HELB platforms.
The board has encouraged continuing students to submit their applications early to allow sufficient time for processing and disbursement before the start of the academic year.
Support Under the Funding Model
HELB reaffirmed the government's commitment to financing higher education through the current student-centred funding model. The board said eligible students will continue receiving financial support through a combination of loans and scholarships based on their assessed level of need.
Students are advised to monitor official HELB communication channels for the exact date when the first-time application portal will be opened and for detailed application requirements.
